No

Item

Process capability parameter

1

Base material

FR-4｜High Tg｜Halogen-free｜PTFE｜Ceramic PCB｜Polyimide｜

2

PCB type

PCB｜FPC｜R-FPC｜HDI

3

Max layer count

64 layers

4

Min base copper thickness

1/3 OZ （12um）

5

Max finished copper thickness

6 OZ

6

Min trace width/spacing

Inner layer

2/2mil （H/H OZ base copper）

7

Outer layer

2.5/2.5mil （H/H OZ  base copper）

8

Min spacing between hole to inner layer conductor

6mil

9

Min spacing between hole to outer layer conductor

6mil

10

Min annular ring for via

3mil

11

Min annular ring for component hole

5mil

12

Min BGA diameter

8mil

13

Min BGA pitch

0.4mm

14

Min hole size

0.15mm（CNC）｜0.1mm（Laser）

15

Max aspect ratios

20:1

16

Min soldermask bridge width

3mil

17

Soldermask/circuit processing method

Film｜LDI

18

Min thickness for insulating layer

2mil

19

HDI & special type PCB

HDI（1-3 steps）｜R-FPC（2-16 layers）｜High frequency mix-pressing（2-14 layers）｜Buried capacitance & resistance ……

20

Surface treatment type

ENIG｜HAL｜HAL lead free｜OSP｜Immersion Sn｜Immersion silver｜Plating hard gold｜Plating silver

201

Max PCB size

609*889mm