Quality Management
Advanced Quality Management Program
Our continuous improvement program, also referred to as our Advanced Quality Management program (AQMP), includes the regular monitoring of product characteristics and process variables using control planes and FMEAs. These activities that fall within the scope of SPC, which is a central part of the AQMP and integrates functions like process engineering, purchasing, fabricating, inspecting and testing. JieTeng Electronics has initiated a AQMP leading to real-time monitoring of the main manufacturing processes variables. The selection of these variables is done through statistically designed experiments. The measuring of the variables takes place with in-house calibrated test and measurement equipment, as well as external testing labs. Results are reviewed, analysed leading to process improvements. As a result, the conscientious efforts of all our associates and investment yielded our ability to design PCBs to the following industry standards:
ISO9001 / AS9100
MIL-PRF-31032 Certified
IPC 6012DS Class 3
Nadcap Pursuing
Class 3 / Military / Aerospace
Exceeding Standards
We are a leading manufacturer of high density, high reliability printed circuit boards for the Military and Aerospace Industry. Our state-of-the-art facility is specifically configured for the high mix, low to medium volume customer quick-turn requirements. We offer a wide range of advanced high speed and high performance military and aerospace preferred materials combined with our expertise to push the envelope on high density board designs.Our extensive SPC controls provide the enhanced, repeatable process capabilities to match and sometimes exceed our customers’ expectations. JTPCB offers RoHS compatible materials and processes to provide environmentally compliant solutions for our customers and our community. Our powerful front-end engineering department features eleven single seat Cam stations running Genesis 2000 Cam software compatible with the ODB++ enhancement. Design Rule Checks, Design for Manufacturability, and Impedance Modeling are conducted efficiently and accurately to ensure complete customer satisfaction and improve initial product integrity. We offer concurrent engineering services to help you reduce design cycle times. We also provide on-site and off-site DFM and DFR training sessions to ensure that we become your first choice for new design requirements. All our work meets or exceeds industry & military standards. A substantial part of the company’s production are boards manufactured to Class 3 IPC 6012DS, Class 3 standard with U.L. compliance.
Failure Analyisis
PCB Investigation
Failure Analysis is the investigation into why a board may have failed post production. Although rare, it does happen. Failures could be due in part to a process problem in the manufacturing of the PCB or at the assembly phase of the board. Some of the most common causes of PCB failures are listed below. Plated Though Holes (PTH) Via Opens this could be caused by poor drilled hole quality, nail-heading, and thin electroplated copper. Inner Layer Separation failed inner layer connection to a PTH solder joint is related to poor inner layer strength caused by lack of etchback treatment during PCB fabrication. Exposed IMC on Hot Air Solder Level (HASL) PCB poor quality HASL finishes on PCB's can cause severe solderability problems during reflow soldering operations. Exposed copper IMC oxidizes and becomes very difficult to wet during reflow. Component solderability, excessive organics in the tin-lead coating on the QFP leads can cause solderability issues.