With the progress of electronic design technology and manufacturing technology, electronic products are gradually in the high density, high functional, lightweight and high transmission rate, the trend of development; Along with the rapid development of the chip miniaturization, the quantity of data transmission, the work frequency of the system is becoming more and more high. Circuit design, structure design and process technology are three main factors of electronic product design. If you want to be a good electronic products, not only need good circuit design, also need good manufacturability, because good manufacturability can reduce product production problems, shorten the product development process, reduce the design cost, so as to achieve the aim of improving product competitiveness. Therefore, product design engineer in electronic product design to the PCB material selection is particularly important.
Rogers company vice President of asia-pacific markets, people will think, "as the communication technology from 2 G and 2.5 G to 3 G, as well as the current 4 G， 5 G, data transmission throughput is more and more big, the bandwidth of the need to more and more wide, the frequency is higher and higher, the miniaturization of equipment is also one of the development trend of the future, and once equipment smaller, requires PCB has higher heat conduction ability and higher dielectric constant." He said, adding that the high frequency circuit materials mainly used in high power amplifier, the base station antenna, global positioning system (GPS), weather radar and meteorological satellite, and automotive radar and sensors, etc.
When the circuit operating frequency in the radio frequency spectrum, the design engineer can choose the plank range reduced substantially. Rogers RO4835 high-frequency plate special formula to improve the oxidation resistance. Under a certain temperature to use for a long time, it can provide special and stable performance, while maintaining and FR4 thermosetting resin material processing advantages. Like RO4350B, at the same time under 10 GHZ dielectric constant (Dk) is 3.48, dielectric loss (Df) is 0.0037, and a low coefficient of thermal expansion (CTE) of Z axis, ensure in various processing and the reliability of the metals via operating conditions. The X axis and Y axis expansion coefficient of the material similar to copper, excellent dimensional stability. When it comes to how to choose the high frequency circuit plank, Rogers advanced circuit board materials division in Asia market development manager jin said, "with Dk and Df. Main parameters in the circuit board materials used in high frequency circuit board, the Dk value of stability is the assurance of plank reliability; Df values should be small as far as possible, in order to reduce loss of signal. And, in some high speed, large data transmission system is also using high-frequency plate." Jin highlights Rogers company all circuit board to meet RoHS standards, and some products have no halide. She also said, "because now use halogen free plate is not mandatory for the standards of the state, have the demand of company and not many, but Rogers is reserve for future needs.
In addition, 2929 bonding sheet is Rogers company recently launched another high-performance circuit plank product. It is a kind of glass fiber reinforced thin hydrocarbon bonding sheet, can be used for high performance, high reliability, a multilayer structure. The product under the microwave frequency Dk is 2.9, Df low (< 0.003), very suitable for pressing laminated matchs with highperformance circuit board materials. It can use the traditional flat press pressing and vacuum chamber pressure machine, it can provide the thickness of 0.0015, 0.002, and 0.003 inches.
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Shenzhen JieTeng Precision Electronics Co., Ltd.
Contact Person： Sophia Wen
Mobile：13510797526
Q Q： 3342625352
Phone：0755-23500787
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Skype : JTPCB ; JIETENGPCB
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Article keywords:The Most Commonly Used Selection Method of High Frequency Circuit Board Materials