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序号No
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项目Item
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技术能力参数Process capability parameter
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1
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基材
Base material
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FR-4｜High Tg｜Halogen-free｜PTFE｜Ceramic PCB｜Polyimide｜
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2
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印制板类型
PCB type
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PCB｜FPC｜R-FPC｜HDI
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3
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最高层次
Max layer count
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64层
64 layers
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4
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最小基铜厚
Min base copper thickness
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1/3 OZ （12um）
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5
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最大完成铜厚
Max finished copper thickness
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6 OZ
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6
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最小线宽/间距
Min trace width/spacing
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内层
Inner layer
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2/2mil （H/H OZ base copper）
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7
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外层
Outer layer
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2.5/2.5mil （H/H OZ base copper）
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8
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孔到内层导体最小间距
Min spacing between hole to inner layer conductor
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6mil
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9
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孔到外层导体最小间距
Min spacing between hole to outer layer conductor
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6mil
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10
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最小过孔焊环
Min annular ring for via
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3mil
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11
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最小元件孔焊环
Min annular ring for component hole
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5mil
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12
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最小BGA焊盘
Min BGA diameter
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8mil
|
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13
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最小BGA Pitch
Min BGA pitch
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0.4mm
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14
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最小成品孔径
Min hole size
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0.15mm（CNC）｜0.1mm（Laser）
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15
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最大板厚孔径比
Max aspect ratios
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20:1
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16
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最小阻焊桥宽
Min soldermask bridge width
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3mil
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17
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阻焊/线路加工方式
Soldermask/circuit processing method
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菲林｜激光直接成像
Film｜LDI
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|
18
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最小绝缘层厚
Min thickness for insulating layer
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2mil
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19
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HDI及特种板
HDI & special type PCB
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HDI（1-3 steps）｜R-FPC（2-16 layers）｜High frequency mix-pressing（2-14 layers）｜Buried capacitance & resistance ……
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20
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表面处理类型
Surface treatment type
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化学沉金｜有铅/无铅喷锡｜OSP｜沉锡｜沉银｜镀厚金｜镀银
ENIG｜HAL｜HAL lead free｜OSP｜Immersion Sn｜Immersion silver｜Plating hard gold｜Plating silver
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|
201
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最大加工尺寸
Max PCB size
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609*889mm
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