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Copper substrate with thermoelectric separation
 
 

  • Copper substrate with thermoelectric separation

  • Release time:2024-9-27 10:15:49
  • Product Profile：
    Copper substrate with thermoelectric separation
    Layer ：1  ，
    Material：Copper Based 
    Board Thickness:  1.6mm,
    Copper thickness：1oz 35um,
    Surface Treatment：Lead-free HASL
    Special Processing: thermoelectric separation
    Outer Track W/S:  
    Inner Track W/S:
    Min. Hole Diameter:  
hotline:0086-755-2350 0787

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Factory:  2nd Building, ChaoChang Tech Park, No.8, GuangTian Road, LuoTian Village, 

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